Detail publikace

Textile-integrated electronics: state of the art

RAIDA, Z. LÁČÍK, J. DŘÍNOVSKÝ, J. CUPAL, M. PRÁŠEK, J. KRÁČALOVÁ, D. PROCHÁZKA, J. LÉDROVÁ, Z.

Originální název

Textile-integrated electronics: state of the art

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The paper summarizes experience with the development of high-frequency electronic components which are manufactured on a three-dimensional knitted material instead of a conventional microwave substrate. Attention is turned to specific aspects of the design, manufacturing and integration of components to applications. Technological problems, which have not been solved yet, are discussed.

Klíčová slova

Three-dimensional knitted fabric, sewing, screen printing, textile-integrated waveguide (TIW), textile-integrated antenna (TIA), vehicular applications

Autoři

RAIDA, Z.; LÁČÍK, J.; DŘÍNOVSKÝ, J.; CUPAL, M.; PRÁŠEK, J.; KRÁČALOVÁ, D.; PROCHÁZKA, J.; LÉDROVÁ, Z.

Vydáno

1. 10. 2020

Nakladatel

IEEE

Místo

Varšava, Polsko

ISBN

978-83-949421-7-5

Kniha

Proceedings of MIKON 2020

Strany od

232

Strany do

236

Strany počet

5

URL

https://ieeexplore.ieee.org/document/9253788

BibTex

@inproceedings{BUT165740,
  author="Zbyněk {Raida} and Jaroslav {Láčík} and Jiří {Dřínovský} and Miroslav {Cupal} and Jan {Prášek} and Dita {Kráčalová} and Jiří {Procházka} and Zdeňka {Lédrová}",
  title="Textile-integrated electronics: state of the art",
  booktitle="Proceedings of MIKON 2020",
  year="2020",
  pages="232--236",
  publisher="IEEE",
  address="Varšava, Polsko",
  doi="10.23919/MIKON48703.2020.9253788",
  isbn="978-83-949421-7-5",
  url="https://ieeexplore.ieee.org/document/9253788"
}