Detail publikace

Efficient Lossy Compression of Ultrasound Data

KLEPÁRNÍK, P. ZEMČÍK, P. JAROŠ, J.

Originální název

Efficient Lossy Compression of Ultrasound Data

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Large-scale numerical simulations of high-intensity focused ultrasound (HIFU), important for model-based treatment planning, generate large amounts of data. Typically, it is necessary to save hundreds of gigabytes during simulation. We proposed a novel algorithm for time varying simulation data compression specialized for HIFU. Our approach is especially focused on the on-the-fly parallel data compression during simulations. Now, we are able to compress 3D pressure time series of linear and nonlinear simulations with very promising compression ratios and errors (over 80 % of the space can be saved with an acceptable error). The proposed compression will be helpful for significant reduction of resources, such as CPU time, storage space, network bandwidth, etc., enabling better treatment planning using fast volume data visualizations. The paper describes the proposed method, its experimental evaluation, and comparison to the state of the art.

Klíčová slova

signal compression, ultrasound simulation, high intensity focused ultrasound, k-Wave toolbox

Autoři

KLEPÁRNÍK, P.; ZEMČÍK, P.; JAROŠ, J.

Vydáno

18. 6. 2018

Nakladatel

Institute of Electrical and Electronics Engineers

Místo

Bilbao

ISBN

978-1-5386-4662-5

Kniha

2017 IEEE International Symposium on Signal Processing and Information Technology, ISSPIT 2017

Strany od

232

Strany do

237

Strany počet

6

URL

http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8388647&isnumber=8388305

BibTex

@inproceedings{BUT154994,
  author="Petr {Klepárník} and Pavel {Zemčík} and Jiří {Jaroš}",
  title="Efficient Lossy Compression of Ultrasound Data",
  booktitle="2017 IEEE International Symposium on Signal Processing and Information Technology, ISSPIT 2017",
  year="2018",
  pages="232--237",
  publisher="Institute of Electrical and Electronics Engineers",
  address="Bilbao",
  doi="10.1109/ISSPIT.2017.8388647",
  isbn="978-1-5386-4662-5",
  url="http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8388647&isnumber=8388305"
}