Detail publikace

Multidisciplinary Matter of Microelectronics Technology Education

Originální název

Multidisciplinary Matter of Microelectronics Technology Education

Anglický název

Multidisciplinary Matter of Microelectronics Technology Education

Jazyk

en

Originální abstrakt

This paper summarizes the both theoretical and practical experience gained in the microelectronic technology area during last twenty years. The overview of new microelectronics technology education system kept at Brno University of Technology, Faculty of Electrical Engineering and Communication (BUT, FEEC) in the study program “Microelectronics” is presented. Microelectronics Technology Education with emphasis on Assembly, Interconnection and Packaging is one of the several specializations in this branch. Basic knowledge about construction of electronics instruments and equipments is more and more important for all, because the larger number of people using them more frequently.

Anglický abstrakt

This paper summarizes the both theoretical and practical experience gained in the microelectronic technology area during last twenty years. The overview of new microelectronics technology education system kept at Brno University of Technology, Faculty of Electrical Engineering and Communication (BUT, FEEC) in the study program “Microelectronics” is presented. Microelectronics Technology Education with emphasis on Assembly, Interconnection and Packaging is one of the several specializations in this branch. Basic knowledge about construction of electronics instruments and equipments is more and more important for all, because the larger number of people using them more frequently.

BibTex


@inproceedings{BUT15390,
  author="Ivan {Szendiuch}",
  title="Multidisciplinary Matter of Microelectronics Technology Education",
  annote="This paper summarizes the both theoretical and practical experience gained in the microelectronic technology area during last twenty years. The overview of new microelectronics technology education system kept at Brno University of Technology, Faculty of Electrical Engineering and Communication (BUT, FEEC) in the study program “Microelectronics” is presented. Microelectronics Technology Education with emphasis on Assembly, Interconnection and Packaging is one of the several specializations in this branch. Basic knowledge about construction of electronics instruments and equipments is more and more important for all, because the larger number of people using them more frequently.",
  address="Silisian University of Technology",
  booktitle="Proceedings Intational Conference on Engineering Education",
  chapter="15390",
  institution="Silisian University of Technology",
  journal="International Conference on Engineering Education and Research "Progress Through Partnership"",
  year="2005",
  month="july",
  pages="468",
  publisher="Silisian University of Technology",
  type="conference paper"
}