Detail publikace

Solder joint quality evaluation based on heating factor

Originální název

Solder joint quality evaluation based on heating factor

Anglický název

Solder joint quality evaluation based on heating factor

Jazyk

en

Originální abstrakt

Purpose – The purpose of this paper is to increase the reliability of manufactured electronics and to reveal reliability significant factors. The experiments were focused especially on the influence of the reflow oven parameters presented by a heating factor. Design/methodology/approach – The shear strength of the surface mount device (SMD) resistors and their joint resistance were analyzed. The resistors were assembled with two Sn/Ag/Cu-based and one Bi-based solder pastes, and the analysis was done for several values of the heating factor and before and after isothermal aging. The measurement of thickness of intermetallic compounds was conducted on the micro-sections of the solder joints. Findings – The shear strength of solder joints based on the Sn/Ag/Cu-based solder alloy started to decline after the heating factor reached the value of 500 s · K, whereas the shear strength of the solder alloy based on the Bi alloy (in the measured range) always increased with an increase in the heating factor. Also, the Bi-based solder joints showed shear strength increase after isothermal aging in contrast to Sn/Ag/Cu-based solder joints, which showed shear strength decrease. Originality/value – The interpretation of the results of such a comprehensive measurement leads to a better understanding of the mutual relation between reliability and other technological parameters such as solder alloy type, surface finish and parameters of the soldering process.

Anglický abstrakt

Purpose – The purpose of this paper is to increase the reliability of manufactured electronics and to reveal reliability significant factors. The experiments were focused especially on the influence of the reflow oven parameters presented by a heating factor. Design/methodology/approach – The shear strength of the surface mount device (SMD) resistors and their joint resistance were analyzed. The resistors were assembled with two Sn/Ag/Cu-based and one Bi-based solder pastes, and the analysis was done for several values of the heating factor and before and after isothermal aging. The measurement of thickness of intermetallic compounds was conducted on the micro-sections of the solder joints. Findings – The shear strength of solder joints based on the Sn/Ag/Cu-based solder alloy started to decline after the heating factor reached the value of 500 s · K, whereas the shear strength of the solder alloy based on the Bi alloy (in the measured range) always increased with an increase in the heating factor. Also, the Bi-based solder joints showed shear strength increase after isothermal aging in contrast to Sn/Ag/Cu-based solder joints, which showed shear strength decrease. Originality/value – The interpretation of the results of such a comprehensive measurement leads to a better understanding of the mutual relation between reliability and other technological parameters such as solder alloy type, surface finish and parameters of the soldering process.

BibTex


@article{BUT150637,
  author="Jiří {Starý} and Karel {Dušek}",
  title="Solder joint quality evaluation based on heating factor",
  annote="Purpose – The purpose of this paper is to increase the reliability of manufactured electronics and to reveal reliability significant factors. The
experiments were focused especially on the influence of the reflow oven parameters presented by a heating factor.
Design/methodology/approach – The shear strength of the surface mount device (SMD) resistors and their joint resistance were analyzed. The
resistors were assembled with two Sn/Ag/Cu-based and one Bi-based solder pastes, and the analysis was done for several values of the heating factor and
before and after isothermal aging. The measurement of thickness of intermetallic compounds was conducted on the micro-sections of the solder joints.
Findings – The shear strength of solder joints based on the Sn/Ag/Cu-based solder alloy started to decline after the heating factor reached the value
of 500 s · K, whereas the shear strength of the solder alloy based on the Bi alloy (in the measured range) always increased with an increase in the
heating factor. Also, the Bi-based solder joints showed shear strength increase after isothermal aging in contrast to Sn/Ag/Cu-based solder joints,
which showed shear strength decrease.
Originality/value – The interpretation of the results of such a comprehensive measurement leads to a better understanding of the mutual relation
between reliability and other technological parameters such as solder alloy type, surface finish and parameters of the soldering process.",
  chapter="150637",
  doi="10.1108/CW-10-2017-0059",
  howpublished="print",
  number="1",
  volume="44",
  year="2018",
  month="january",
  pages="1--8",
  type="journal article in Web of Science"
}