Detail publikace

Thermomechanical stressing of microelectronics structures

Originální název

Thermomechanical stressing of microelectronics structures

Anglický název

Thermomechanical stressing of microelectronics structures

Jazyk

en

Originální abstrakt

Termomechanical stressing microeletronics structure

Anglický abstrakt

Termomechanical stressing microeletronics structure

BibTex


@inproceedings{BUT14676,
  author="Marek {Novotný} and Ivan {Szendiuch} and Jindřich {Bulva}",
  title="Thermomechanical stressing of microelectronics structures",
  annote="Termomechanical stressing microeletronics structure",
  address="IMAPS BENELUX",
  booktitle="Proceedings EMPC 2005",
  chapter="14676",
  institution="IMAPS BENELUX",
  year="2005",
  month="january",
  pages="513",
  publisher="IMAPS BENELUX",
  type="conference paper"
}