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NĚMEC, I. ŠTEKBAUER, H. VANĚČKOVÁ, A. VLK, Z.
Originální název
Explicit and implicit method in nonlinear seismic analysis
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
angličtina
Originální abstrakt
The paper deals with suitability of use of the explicit and implicit method in heavily nonlinear seismic analysis. Considering typical time of duration of earthquakes from several seconds to approximately twenty seconds, it would seem that use of the implicit method is definitely more suitable. The shape of accelerograms, however, requires quite short time steps. For the explicit method, on the other hand, very short time steps are required in order to obtain a stable solution. Both methods must be compared with respect to a heavily nonlinear response, typical for seismicity. Conclusions of the paper are made on the basis of detailed numerical study and may be very useful for practice.
Klíčová slova
explicit method, implicit method, seismicity
Autoři
NĚMEC, I.; ŠTEKBAUER, H.; VANĚČKOVÁ, A.; VLK, Z.
Vydáno
21. 5. 2017
Nakladatel
EDP Sciences
ISBN
9781510841147
Kniha
Dynamics of Civil Engineering and Transport Structures and Wind Engineering - DYN-WIND 2017
Edice
sborník konference DYN-WIND 2017
ISSN
2261-236X
Periodikum
MATEC Web of Conferences
Ročník
107
Stát
Francouzská republika
Strany počet
8
URL
https://www.matec-conferences.org/articles/matecconf/abs/2017/21/matecconf_dyn2017_00066/matecconf_dyn2017_00066.html
Plný text v Digitální knihovně
http://hdl.handle.net/11012/208214
BibTex
@inproceedings{BUT145069, author="Ivan {Němec} and Hynek {Štekbauer} and Adéla {Gálová} and Zbyněk {Vlk}", title="Explicit and implicit method in nonlinear seismic analysis", booktitle="Dynamics of Civil Engineering and Transport Structures and Wind Engineering - DYN-WIND 2017", year="2017", series="sborník konference DYN-WIND 2017", journal="MATEC Web of Conferences", volume="107", pages="8", publisher="EDP Sciences", doi="10.1051/matecconf/201710700066", isbn="9781510841147", issn="2261-236X", url="https://www.matec-conferences.org/articles/matecconf/abs/2017/21/matecconf_dyn2017_00066/matecconf_dyn2017_00066.html" }