Detail publikace

Reflow Soldering in Vapour Phase Systems

SZENDIUCH, I. HURBAN, M.

Originální název

Reflow Soldering in Vapour Phase Systems

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

IMAPS FLASH CONFERENCE 2016 is international conference for young scientist and industry experts in area of microelectronics packaging and interconnection. This area is very important and decisive for design of modrn electronic systems and circuits

Klíčová slova

Reflow soldering, solder alloy, reliability , soldering process

Autoři

SZENDIUCH, I.; HURBAN, M.

Vydáno

3. 11. 2016

Nakladatel

Novpress s.r.o.

Místo

Brno

ISBN

978-80-214-5416-3

Kniha

2nd IMAPS FLASH CONFERENCE 2016

Edice

1

Číslo edice

1

Strany od

42

Strany do

43

Strany počet

96

BibTex

@inproceedings{BUT130743,
  author="Ivan {Szendiuch} and Milan {Hurban}",
  title="Reflow Soldering in Vapour Phase Systems",
  booktitle="2nd IMAPS FLASH CONFERENCE 2016",
  year="2016",
  series="1",
  number="1",
  pages="42--43",
  publisher="Novpress s.r.o.",
  address="Brno",
  isbn="978-80-214-5416-3"
}