Detail publikace

The Quality of BGA Solder Joint with Underfill

Originální název

The Quality of BGA Solder Joint with Underfill

Anglický název

The Quality of BGA Solder Joint with Underfill

Jazyk

en

Originální abstrakt

This paper deals with investigation of mechanical behavior (shear strength) of soldered BGA package with and without underfill on FR4 and Al2O3 carriers. BGA soldered on FR4 (ENIG) had higher value of shear strength than BGA soldered on alumina substrate with conductive thick film layer. Results was used for validation of virtual model and simulation in ANSYS Workbench. This simulation will be used for prediction of thermomechanical behavior of BGA packages soldered on alumina substrates and on organic substrates FR4.

Anglický abstrakt

This paper deals with investigation of mechanical behavior (shear strength) of soldered BGA package with and without underfill on FR4 and Al2O3 carriers. BGA soldered on FR4 (ENIG) had higher value of shear strength than BGA soldered on alumina substrate with conductive thick film layer. Results was used for validation of virtual model and simulation in ANSYS Workbench. This simulation will be used for prediction of thermomechanical behavior of BGA packages soldered on alumina substrates and on organic substrates FR4.

BibTex


@inproceedings{BUT130695,
  author="Josef {Skácel} and Alexandr {Otáhal} and Pavel {Řihák} and Ivan {Szendiuch}",
  title="The Quality of BGA Solder Joint with Underfill",
  annote="This paper deals with investigation of mechanical behavior (shear strength) of soldered BGA package with and without underfill on FR4 and Al2O3 carriers. BGA soldered on FR4 (ENIG) had higher value of shear strength than BGA soldered on alumina substrate with conductive thick film layer. Results was used for validation of virtual model and simulation in ANSYS Workbench. This simulation will be used for prediction of thermomechanical behavior of BGA packages soldered on alumina substrates and on organic substrates FR4.",
  booktitle="Sborník IMAPS flash Conference 2016",
  chapter="130695",
  howpublished="online",
  number="3",
  year="2016",
  month="december",
  pages="19--22",
  type="conference paper"
}