Detail publikace

Investigation of Creep and Stress Relaxation of Lead-free Solder Joints

Originální název

Investigation of Creep and Stress Relaxation of Lead-free Solder Joints

Anglický název

Investigation of Creep and Stress Relaxation of Lead-free Solder Joints

Jazyk

en

Originální abstrakt

Investigation of lead-free solders by mechanical tests (creep and stress). Comparation of SnAg, SnAgCu with SnPb.

Anglický abstrakt

Investigation of lead-free solders by mechanical tests (creep and stress). Comparation of SnAg, SnAgCu with SnPb.

BibTex


@inproceedings{BUT12485,
  author="Ivan {Szendiuch}",
  title="Investigation of Creep and Stress Relaxation of Lead-free Solder Joints",
  annote="Investigation of lead-free solders by mechanical tests (creep and stress). Comparation of SnAg, SnAgCu with SnPb.",
  address="IMAPS USA",
  booktitle="37th IMAPS Symposium on Microelectronics",
  chapter="12485",
  institution="IMAPS USA",
  year="2004",
  month="november",
  pages="1-10",
  publisher="IMAPS USA",
  type="conference paper"
}