Detail publikace

Elektrotermální simulace degradace bondwiru pro nejisté geometrie

CASPER, T. DE GERSEM, H. GILLON, R. GÖTTHANS, T. KRATOCHVÍL, T. SCHÖPS, S.

Originální název

Electrothermal simulation of bonding wire degradation under uncertain geometries

Český název

Elektrotermální simulace degradace bondwiru pro nejisté geometrie

Anglický název

Electrothermal simulation of bonding wire degradation under uncertain geometries

Typ

článek ve sborníku

Jazyk

en

Originální abstrakt

In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Technique (FIT). In particular, the design of bonding wires with respect to thermal degradation is investigated. Instead of resolving the wires by the computational grid, lumped element representations are introduced as point-to-point connections in the spatially distributed model. Fabrication tolerances lead to uncertainties of the wires' parameters and influence the operation and reliability of the final product. Based on geometric measurements, the resulting variability of the wire temperatures is determined using the stochastic electrothermal field-circuit model.

Český abstrakt

V tomto dokumentu jsou rozebrány elektrotermické jevy v elektronických součástkách. Prostřednictvím simulace pole pomocí konečných prvků ukazujeme degradaci bondwireů.

Anglický abstrakt

In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Technique (FIT). In particular, the design of bonding wires with respect to thermal degradation is investigated. Instead of resolving the wires by the computational grid, lumped element representations are introduced as point-to-point connections in the spatially distributed model. Fabrication tolerances lead to uncertainties of the wires' parameters and influence the operation and reliability of the final product. Based on geometric measurements, the resulting variability of the wire temperatures is determined using the stochastic electrothermal field-circuit model.

Vydáno

14.03.2016

Nakladatel

IEEE

Místo

Dresden, Germany

ISBN

978-3-9815370-6-2

Kniha

2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)

Strany od

1297

Strany do

1302

Strany počet

6

BibTex


@inproceedings{BUT124488,
  author="Thorben {Casper} and Herbert {De Gersem} and Renaud {Gillon} and Tomáš {Götthans} and Tomáš {Kratochvíl} and Sebastian {Schöps}",
  title="Electrothermal simulation of bonding wire degradation under uncertain geometries",
  annote="In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Technique (FIT). In particular, the design of bonding wires with respect to thermal degradation is investigated. Instead of resolving the wires by the computational grid, lumped element representations are introduced as point-to-point connections in the spatially distributed model. Fabrication tolerances lead to uncertainties of the wires' parameters and influence the operation and reliability of the final product. Based on geometric measurements, the resulting variability of the wire temperatures is determined using the stochastic electrothermal field-circuit model.",
  address="IEEE",
  booktitle="2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)",
  chapter="124488",
  howpublished="online",
  institution="IEEE",
  year="2016",
  month="march",
  pages="1297--1302",
  publisher="IEEE",
  type="conference paper"
}