Detail publikace

Analysis of silver diffusion into thick film resistor layers

Originální název

Analysis of silver diffusion into thick film resistor layers

Anglický název

Analysis of silver diffusion into thick film resistor layers

Jazyk

en

Originální abstrakt

A silver diffusion and migration from contact electrode into thick film resistive layer and its influence on resistor characteristics was analysed. Strong dependence of non-linearity and noise on the contact electrode material was observed. Thick film resistors with AgPd contact electrode have higher value of third harmonic voltage, but show better long term stability and reliability comparing with resistors with Ag contact electrode. Silver diffusion results to the resistive layer conductivity increase not only in the vicinity of contact, but in the thick film resistor also. This leads to the lowering of the electric field intensity near the contact and effective shortening of thick film resistor length. The scanning electron microscopy, noise spectroscopy and third harmonic measurements were used to investigate this effect. Numerical model was performed to estimate the influence of silver diffusion and migration on resistance changes due to firing and ageing. The model shows that the electrode geometry plays dominant role for a current distribution in the vicinity of contact of thick film resistor layer. The higher sharpness of metallic contact, the higher electric field intensity peak appears in the vicinity of the contact edge. The silver diffusion from contact electrode results to resistive layer change and then the maximum electric field intensity is shifted from contact – thick film interface into thick film volume. The characteristics of ensembles of samples prepared by different technologies were analysed by nonlinearity and noise spectroscopy. In case of silver electrode samples, the noise or non-linearity sources are not in thick film-silver contact interface. We found that they are not connected with irreversible processes at the contact interface.

Anglický abstrakt

A silver diffusion and migration from contact electrode into thick film resistive layer and its influence on resistor characteristics was analysed. Strong dependence of non-linearity and noise on the contact electrode material was observed. Thick film resistors with AgPd contact electrode have higher value of third harmonic voltage, but show better long term stability and reliability comparing with resistors with Ag contact electrode. Silver diffusion results to the resistive layer conductivity increase not only in the vicinity of contact, but in the thick film resistor also. This leads to the lowering of the electric field intensity near the contact and effective shortening of thick film resistor length. The scanning electron microscopy, noise spectroscopy and third harmonic measurements were used to investigate this effect. Numerical model was performed to estimate the influence of silver diffusion and migration on resistance changes due to firing and ageing. The model shows that the electrode geometry plays dominant role for a current distribution in the vicinity of contact of thick film resistor layer. The higher sharpness of metallic contact, the higher electric field intensity peak appears in the vicinity of the contact edge. The silver diffusion from contact electrode results to resistive layer change and then the maximum electric field intensity is shifted from contact – thick film interface into thick film volume. The characteristics of ensembles of samples prepared by different technologies were analysed by nonlinearity and noise spectroscopy. In case of silver electrode samples, the noise or non-linearity sources are not in thick film-silver contact interface. We found that they are not connected with irreversible processes at the contact interface.

BibTex


@inproceedings{BUT12104,
  author="Vlasta {Sedláková} and Petr {Sedlák} and Josef {Šikula} and Dubravka {Ročak} and Marko {Hrovat} and Marina {Santo-Zarnik} and Darko {Belavic}",
  title="Analysis of silver diffusion into thick film resistor layers",
  annote="A silver diffusion and migration from contact electrode into thick film resistive layer and its influence on resistor characteristics was analysed. Strong dependence of non-linearity and noise on the contact electrode material was observed. Thick film resistors with AgPd contact electrode have higher value of third harmonic voltage, but show better long term stability and reliability comparing with resistors with Ag contact electrode. Silver diffusion results to the resistive layer conductivity increase not only in the vicinity of contact, but in the thick film resistor also. This leads to the lowering of the electric field intensity near the contact and effective shortening of thick film resistor length. The scanning electron microscopy, noise spectroscopy and third harmonic measurements were used to investigate this effect. Numerical model was performed to estimate the influence of silver diffusion and migration on resistance changes due to firing and ageing. The model shows that the electrode geometry plays dominant role for a current distribution in the vicinity of contact of thick film resistor layer. The higher sharpness of metallic contact, the higher electric field intensity peak appears in the vicinity of the contact edge. The silver diffusion from contact electrode results to resistive layer change and then the maximum electric field intensity is shifted from contact – thick film interface into thick film volume. The characteristics of ensembles of samples prepared by different technologies were analysed by nonlinearity and noise spectroscopy. In case of silver electrode samples, the noise or non-linearity sources are not in thick film-silver contact interface.  We found that they are not connected with irreversible processes at the contact interface.",
  address="IMAPS CZ&SK Chapter",
  booktitle="Proceedings of 3rd European Microelectronics and Packaging Symposium with Table-Top Exhibition",
  chapter="12104",
  institution="IMAPS CZ&SK Chapter",
  year="2004",
  month="january",
  pages="660",
  publisher="IMAPS CZ&SK Chapter",
  type="conference paper"
}