Detail publikace

Effects and Interactions of Materials and Chemistry in Lead Free Soldering

STARÝ, J.

Originální název

Effects and Interactions of Materials and Chemistry in Lead Free Soldering

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Material selection of solder alloy composition, type of flux, substrate surface treatments and influence of controlled /non controlled soldering atmosphere in optimized soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Implementation of lead free soldering process needs some knowledges about these materials and about their effects and interactions during soldering. DOE is very useful tool for help in these characteristic study. This short article is focused on very important part of soldering process – wetting and spreading phenomena and analyses effects and interactions among material factors by using DOE with 4 factors.

Klíčová slova

lead free, solderability. wettability, surface finish, flux, DOE.

Autoři

STARÝ, J.

Rok RIV

2004

Vydáno

14. 9. 2004

Nakladatel

Technological Institute of Crete, Greece

Místo

Crete, Greece

ISBN

80-214-2819-8

Kniha

Socrates Workshop 2004. Intensive Training Programme in Electronic System Design

Strany od

81

Strany do

88

Strany počet

8

BibTex

@inproceedings{BUT12054,
  author="Jiří {Starý}",
  title="Effects and Interactions of Materials and Chemistry in Lead Free Soldering",
  booktitle="Socrates Workshop 2004. Intensive Training Programme in Electronic System Design",
  year="2004",
  pages="8",
  publisher="Technological Institute of Crete, Greece",
  address="Crete, Greece",
  isbn="80-214-2819-8"
}