Detail publikace
Effects and Interactions of Materials and Chemistry in Lead Free Soldering
Originální název
Effects and Interactions of Materials and Chemistry in Lead Free Soldering
Anglický název
Effects and Interactions of Materials and Chemistry in Lead Free Soldering
Jazyk
en
Originální abstrakt
Material selection of solder alloy composition, type of flux, substrate surface treatments and influence of controlled /non controlled soldering atmosphere in optimized soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Implementation of lead free soldering process needs some knowledges about these materials and about their effects and interactions during soldering. DOE is very useful tool for help in these characteristic study. This short article is focused on very important part of soldering process – wetting and spreading phenomena and analyses effects and interactions among material factors by using DOE with 4 factors.
Anglický abstrakt
Material selection of solder alloy composition, type of flux, substrate surface treatments and influence of controlled /non controlled soldering atmosphere in optimized soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Implementation of lead free soldering process needs some knowledges about these materials and about their effects and interactions during soldering. DOE is very useful tool for help in these characteristic study. This short article is focused on very important part of soldering process – wetting and spreading phenomena and analyses effects and interactions among material factors by using DOE with 4 factors.
BibTex
@inproceedings{BUT12054,
author="Jiří {Starý}",
title="Effects and Interactions of Materials and Chemistry in Lead Free Soldering",
annote="Material selection of solder alloy composition, type of flux, substrate surface treatments and influence of controlled /non controlled soldering atmosphere in optimized soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Implementation of lead free soldering process needs some knowledges about these materials and about their effects and interactions during soldering. DOE is very useful tool for help in these characteristic study.
This short article is focused on very important part of soldering process – wetting and spreading phenomena and analyses effects and interactions among material factors by using DOE with 4 factors.
",
address="Technological Institute of Crete, Greece",
booktitle="Socrates Workshop 2004. Intensive Training Programme in Electronic System Design",
chapter="12054",
institution="Technological Institute of Crete, Greece",
year="2004",
month="september",
pages="81",
publisher="Technological Institute of Crete, Greece",
type="conference paper"
}