Detail publikace

Optimization of Through-hole Plating Method for Prototyping

Originální název

Optimization of Through-hole Plating Method for Prototyping

Anglický název

Optimization of Through-hole Plating Method for Prototyping

Jazyk

en

Originální abstrakt

Article discusses the enhancement methods of plating through holes on printed circuit boards. Novum was the addition of vacuum or/and ultrasound during the activation process before the surface metallization. For the copper plating method was used reverse pulse plating.

Anglický abstrakt

Article discusses the enhancement methods of plating through holes on printed circuit boards. Novum was the addition of vacuum or/and ultrasound during the activation process before the surface metallization. For the copper plating method was used reverse pulse plating.

BibTex


@inproceedings{BUT120369,
  author="Alexandr {Otáhal} and Adam {Crha} and Richard {Růžička} and Ivan {Szendiuch} and Václav {Šimek}",
  title="Optimization of Through-hole Plating Method for Prototyping",
  annote="Article discusses the enhancement methods of plating through holes on printed circuit boards. Novum was the addition of vacuum or/and ultrasound during the activation process before the surface metallization. For the copper plating method was used reverse pulse plating.",
  booktitle="Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter",
  chapter="120369",
  howpublished="online",
  number="1_2016",
  year="2015",
  month="october",
  pages="54--56",
  type="conference paper"
}