Detail publikace

Optimization of Through-hole Plating Method for Prototyping

OTÁHAL, A. SZENDIUCH, I. ŠIMEK, V. CRHA, A. RŮŽIČKA, R.

Originální název

Optimization of Through-hole Plating Method for Prototyping

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Article discusses the enhancement methods of plating through holes on printed circuit boards. Novum was the addition of vacuum or/and ultrasound during the activation process before the surface metallization. For the copper plating method was used reverse pulse plating.

Klíčová slova

Through-hole plating, PCB

Autoři

OTÁHAL, A.; SZENDIUCH, I.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.

Rok RIV

2015

Vydáno

15. 10. 2015

ISBN

978-80-214-5270-1

Kniha

Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter

ISSN

1802-4564

Periodikum

ElectroScope - http://www.electroscope.zcu.cz

Ročník

IfC 2015

Číslo

1_2016

Stát

Česká republika

Strany od

54

Strany do

56

Strany počet

3

BibTex

@inproceedings{BUT120369,
  author="Alexandr {Otáhal} and Adam {Crha} and Richard {Růžička} and Ivan {Szendiuch} and Václav {Šimek}",
  title="Optimization of Through-hole Plating Method for Prototyping",
  booktitle="Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter",
  year="2015",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  volume="IfC 2015",
  number="1_2016",
  pages="54--56",
  isbn="978-80-214-5270-1",
  issn="1802-4564"
}