Detail publikace

THERMOMECHANICAL SIMULATION OF MODERN ELECTRONIC PACKAGES

SKÁCEL, J. SZENDIUCH, I.

Originální název

THERMOMECHANICAL SIMULATION OF MODERN ELECTRONIC PACKAGES

Anglický název

ThermoMechanical SIMULATION OF MODERN ELECTRONIC PACKAGES

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

čeština

Originální abstrakt

This paper deals with issue of modern electronic packages mainly thermo-mechanical simulation. The first part is focused on the comparing of QFN (Quad-Flat No leads) and BGA (Ball Grid Array) packages including their advantages and disadvantages. The second part is focused on simulation of these packages in ANSYS program from the point of thermos-mechanical behavior.

Anglický abstrakt

This paper deals with issue of modern electronic packages Mainly thermo-mechanical simulation. The first part is focused on the comparing of QFN (Quad Flat No-leads) and BGA (Ball Grid Array) packages Including Their Advantages and disadvantages. The second part is focused on These packages of simulation in ANSYS program from the point of thermos-mechanical behavior.

Klíčová slova

ANSYS, BGA, QFN, thermo-mechanical behavior

Klíčová slova v angličtině

ANSYS, BGA, QFN, thermo-mechanical behavior

Autoři

SKÁCEL, J.; SZENDIUCH, I.

Rok RIV

2015

Vydáno

23. 4. 2015

Nakladatel

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních

Místo

Brno

ISBN

978-80-214-5148-3

Kniha

Proceedings of the 21st Conference STUDENT EEICT 2015

Strany od

289

Strany do

291

Strany počet

3

URL

http://www.feec.vutbr.cz/EEICT/2015/sbornik/EEICT-2015-sbornik-komplet_v2.pdf

BibTex

@inproceedings{BUT117506,
  author="Josef {Skácel} and Ivan {Szendiuch}",
  title="THERMOMECHANICAL SIMULATION OF MODERN
ELECTRONIC PACKAGES",
  booktitle="Proceedings of the 21st Conference STUDENT EEICT 2015",
  year="2015",
  pages="289--291",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  address="Brno",
  isbn="978-80-214-5148-3",
  url="http://www.feec.vutbr.cz/EEICT/2015/sbornik/EEICT-2015-sbornik-komplet_v2.pdf"
}