Detail publikace

The Vibration Testing as Tool for Optimizing of Two PCB

Originální název

The Vibration Testing as Tool for Optimizing of Two PCB

Anglický název

The Vibration Testing as Tool for Optimizing of Two PCB

Jazyk

en

Originální abstrakt

This article deals with the use of mechanical testing to optimize the configuration of PCB. Specifically, the system of two connected boards is being investigated under the vibration load. Vibration measurement of such system is compared with the computer simulation and results from both methods are then evaluated including defining the main parameters. This research is related to the European project Board on Board (BOB), which focuses on new technology of two board interconnection, which is dedicated for high density assembly and interconnection.

Anglický abstrakt

This article deals with the use of mechanical testing to optimize the configuration of PCB. Specifically, the system of two connected boards is being investigated under the vibration load. Vibration measurement of such system is compared with the computer simulation and results from both methods are then evaluated including defining the main parameters. This research is related to the European project Board on Board (BOB), which focuses on new technology of two board interconnection, which is dedicated for high density assembly and interconnection.

BibTex


@inproceedings{BUT116876,
  author="Alexandr {Otáhal} and Boleslav {Psota} and Ivan {Szendiuch}",
  title="The Vibration Testing as Tool for Optimizing of Two PCB",
  annote="This article deals with the use of mechanical testing to optimize the configuration of PCB. Specifically, the system of two connected boards is being investigated under the vibration load. Vibration measurement of such system is compared with the computer simulation and results from both methods are then evaluated including defining the main parameters. This research is related to the European project Board on Board (BOB), which focuses on new technology of two board interconnection, which is dedicated for high density assembly and interconnection.",
  booktitle="Novel Trends in Electronics Manufacturing - Book of Abtracts 38th International Spring Seminar on Electronics Technology",
  chapter="116876",
  doi="10.1109/ISSE.2015.7248018",
  howpublished="online",
  year="2015",
  month="may",
  pages="339--342",
  type="conference paper"
}