Detail publikace

Wettability SnPb and Lead-free

Originální název

Wettability SnPb and Lead-free

Anglický název

Wettability SnPb and Lead-free

Jazyk

en

Originální abstrakt

Lead free soldering implementation process needs some knowledge about behavior of lead-free materials where fundamental seems to be wettability. Without good wettability the process performance cannot be convenient technical and economical too. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, which are important for solder joint formation, and for final solder joint reliability. This includes optimal selection of fluxes, air/nitrogen atmosphere, solders alloy compositions, surface treatments of components and PCBs and other factors. This paper presents some facts from this area.

Anglický abstrakt

Lead free soldering implementation process needs some knowledge about behavior of lead-free materials where fundamental seems to be wettability. Without good wettability the process performance cannot be convenient technical and economical too. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, which are important for solder joint formation, and for final solder joint reliability. This includes optimal selection of fluxes, air/nitrogen atmosphere, solders alloy compositions, surface treatments of components and PCBs and other factors. This paper presents some facts from this area.

BibTex


@inproceedings{BUT11423,
  author="Ivan {Szendiuch} and Jindřich {Bulva}",
  title="Wettability SnPb and Lead-free",
  annote="Lead free soldering implementation process needs some knowledge about behavior of lead-free materials where fundamental seems to be wettability. Without good wettability the process performance cannot be convenient technical and economical too. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, which are important for solder joint formation, and for final solder joint reliability. This includes optimal selection of fluxes, air/nitrogen atmosphere, solders alloy compositions, surface treatments of components and PCBs and other factors. This paper presents some facts from this area.",
  address="Ing. Zdeněk Novotný CSc.,Brno",
  booktitle="11th Electronic Devices and Systems Conference 2004 Proceedings",
  chapter="11423",
  institution="Ing. Zdeněk Novotný CSc.,Brno",
  year="2004",
  month="january",
  pages="407--411",
  publisher="Ing. Zdeněk Novotný CSc.,Brno",
  type="conference paper"
}