Detail publikace

2D Modelling of Stresses in Solder Joint Connection

Originální název

2D Modelling of Stresses in Solder Joint Connection

Anglický název

2D Modelling of Stresses in Solder Joint Connection

Jazyk

en

Originální abstrakt

This paper describes thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

Anglický abstrakt

This paper describes thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

BibTex


@inproceedings{BUT11421,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="2D Modelling of Stresses in Solder Joint Connection",
  annote="This paper describes thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.",
  address="Ing. Zdeněk Novotný CSc.,Brno",
  booktitle="11th Electronic Devices and Systems Conference 2004 Proceedings",
  chapter="11421",
  institution="Ing. Zdeněk Novotný CSc.,Brno",
  year="2004",
  month="january",
  pages="377",
  publisher="Ing. Zdeněk Novotný CSc.,Brno",
  type="conference paper"
}