Detail publikace

Optimizing of Solder Joint Reliability by 3D Modeling

Originální název

Optimizing of Solder Joint Reliability by 3D Modeling

Anglický název

Optimizing of Solder Joint Reliability by 3D Modeling

Jazyk

en

Originální abstrakt

This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today’s electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical properties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading.

Anglický abstrakt

This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today’s electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical properties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading.

BibTex


@inproceedings{BUT10966,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Optimizing of Solder Joint Reliability by 3D Modeling",
  annote="This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today’s electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical properties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading.",
  address="IMAPS CZ&SK Chapter",
  booktitle="Proceedings of 3rd Microelectronics and Packaging Symposium with Table Top Exhibition",
  chapter="10966",
  institution="IMAPS CZ&SK Chapter",
  year="2004",
  month="january",
  pages="195",
  publisher="IMAPS CZ&SK Chapter",
  type="conference paper"
}