Detail publikace

Optimizing of Solder Joint Reliability by 3D Modeling

BULVA, J., SZENDIUCH, I.

Originální název

Optimizing of Solder Joint Reliability by 3D Modeling

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today’s electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical properties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading.

Klíčová slova v angličtině

solder joint reliability, modelling, ANSYS

Autoři

BULVA, J., SZENDIUCH, I.

Rok RIV

2004

Vydáno

1. 1. 2004

Nakladatel

IMAPS CZ&SK Chapter

Místo

Lanskroun

ISBN

80-239-2835-X

Kniha

Proceedings of 3rd Microelectronics and Packaging Symposium with Table Top Exhibition

Strany od

195

Strany do

394

Strany počet

200

BibTex

@inproceedings{BUT10966,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Optimizing of Solder Joint Reliability by 3D Modeling",
  booktitle="Proceedings of 3rd Microelectronics and Packaging Symposium with Table Top Exhibition",
  year="2004",
  pages="200",
  publisher="IMAPS CZ&SK Chapter",
  address="Lanskroun",
  isbn="80-239-2835-X"
}