Detail publikace

The Use of Computer Simulation in the Electronic Packaging Process

PSOTA, B. BURŠÍK, M. SZENDIUCH, I.

Originální název

The Use of Computer Simulation in the Electronic Packaging Process

Český název

The Use of Computer Simulation in the Electronic Packaging Process

Typ

článek v časopise

Jazyk

cs

Originální abstrakt

This paper deals with the use of the computer simulation for semiconductor chip attach investigation, where the wire bonding is the mostly used process. The main focus lays on the correct definition of the capillary trace, which is essential for creation of a good bond contact as for chip, as well for package or substrate pad. Several simulations for different shapes of loops were created and compared with real bonds, which were done based on the settings from the analysis.

Český abstrakt

This paper deals with the use of the computer simulation for semiconductor chip attach investigation, where the wire bonding is the mostly used process. The main focus lays on the correct definition of the capillary trace, which is essential for creation of a good bond contact as for chip, as well for package or substrate pad. Several simulations for different shapes of loops were created and compared with real bonds, which were done based on the settings from the analysis.

Klíčová slova

ANSYS Workbench, Chip Connection, Simulation, Wirebonding

Rok RIV

2013

Vydáno

18.11.2013

Nakladatel

Trans Tech Publications

Místo

Switzerland

Strany od

201

Strany do

204

Strany počet

4

BibTex


@article{BUT104295,
  author="Boleslav {Psota} and Martin {Buršík} and Ivan {Szendiuch}",
  title="The Use of Computer Simulation in the Electronic Packaging Process",
  annote="This paper deals with the use of the computer simulation for semiconductor chip attach investigation, where the wire bonding is the mostly used process. The main focus lays on the correct definition of the capillary trace, which is essential for creation of a good bond contact as for chip, as well for package or substrate pad. Several simulations for different shapes of loops were created and compared with real bonds, which were done based on the settings from the analysis.",
  address="Trans Tech Publications",
  chapter="104295",
  doi="10.4028/www.scientific.net/KEM.592-593.201",
  institution="Trans Tech Publications",
  number="592-593",
  volume="2014",
  year="2013",
  month="november",
  pages="201--204",
  publisher="Trans Tech Publications",
  type="journal article"
}