Detail publikace

The Use of Computer Simulation in the Electronic Packaging Process

Originální název

The Use of Computer Simulation in the Electronic Packaging Process

Anglický název

The Use of Computer Simulation in the Electronic Packaging Process

Jazyk

en

Originální abstrakt

This paper deals with the problem of the wirebonding process, which is modeled in the simulation process for prediction of the final loop shape. The creation of the virtual model and its evaluation is described.

Anglický abstrakt

This paper deals with the problem of the wirebonding process, which is modeled in the simulation process for prediction of the final loop shape. The creation of the virtual model and its evaluation is described.

BibTex


@misc{BUT104293,
  author="Boleslav {Psota} and Martin {Buršík} and Ivan {Szendiuch}",
  title="The Use of Computer Simulation in the Electronic Packaging Process",
  annote="This paper deals with the problem of the wirebonding process, which is modeled in the simulation process for prediction of the final loop shape. The creation of the virtual model and its evaluation is described.",
  booktitle="Materials Structure & Micromechanics of Fracture",
  chapter="104293",
  howpublished="print",
  year="2013",
  month="july",
  pages="182--182",
  type="abstract"
}