Detail publikace

Investigation of the Mechanical Properties of Lead-Free Solder Materials

OTÁHAL, A. ADÁMEK, M. JANSA, V. SZENDIUCH, I.

Originální název

Investigation of the Mechanical Properties of Lead-Free Solder Materials

Typ

článek v časopise - ostatní, Jost

Jazyk

angličtina

Originální abstrakt

Reliability and life-time of electric/electronic products is still a highly actual and discussed topic. Every electric/electronic product is heterogeneous system which consists not only from components and constructional parts, but also from many interconnections. Basic segments of interconnection are solder joints, actually created by lead-free materials. The passing from well-proven lead solders to lead free compositions brought many new aspects in reliability and life-time of electronic systems. Some of the negative factors are their poor electro-mechanical properties, which are based on complicated microstructure of interlayer interface. This fact causes defects in solder joints and consequential failure of the function. This article is focused on an investigation of mechanical properties by lead-free solder joints. There are investigated various properties of common lead free solder paste depending on various concentrations of O2 by reflow process. Next, there are shown microstructures by micro sections for various concentrations of O2. Mechanical properties (mechanical strength) are tested by shear test equipment DAGE 2400.

Klíčová slova

Soldering, lead-free solder paste, nitrogen atmosphere, shear test.

Autoři

OTÁHAL, A.; ADÁMEK, M.; JANSA, V.; SZENDIUCH, I.

Rok RIV

2013

Vydáno

15. 11. 2013

Nakladatel

Trans Tech Publications

Místo

Switzerland

ISSN

1662-9795

Periodikum

Key Engineering Materials (web)

Ročník

2013

Číslo

592-593

Stát

Švýcarská konfederace

Strany od

453

Strany do

456

Strany počet

4

URL

http://www.scientific.net/KEM.592-593.453

BibTex

@article{BUT104280,
  author="Alexandr {Otáhal} and Martin {Adámek} and Vojtěch {Jansa} and Ivan {Szendiuch}",
  title="Investigation of the Mechanical Properties of Lead-Free Solder Materials",
  journal="Key Engineering Materials (web)",
  year="2013",
  volume="2013",
  number="592-593",
  pages="453--456",
  doi="10.4028/www.scientific.net/KEM.592-593.453",
  issn="1662-9795",
  url="http://www.scientific.net/KEM.592-593.453"
}