Detail publikace

Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate

Originální název

Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate

Anglický název

Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate

Jazyk

en

Originální abstrakt

The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts.

Anglický abstrakt

The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts.

BibTex


@article{BUT102803,
  author="Martin {Klíma} and Boleslav {Psota} and Ivan {Szendiuch}",
  title="Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate",
  annote="The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts.",
  chapter="102803",
  doi="10.1109/ISSE.2013.6648228",
  number="2013",
  volume="36",
  year="2013",
  month="may",
  pages="127--131",
  type="journal article"
}