Detail publikace

Study of Atmosphere Influence on BGA Solder Balls Process

Originální název

Study of Atmosphere Influence on BGA Solder Balls Process

Anglický název

Study of Atmosphere Influence on BGA Solder Balls Process

Jazyk

en

Originální abstrakt

This article deals with the influence of different atmosphere (normal, vapor, nitrogen) on some mechanical parameters, as shear strength, for BGA solder balls (Sn63Pb37, SAC305). There are also micro-sections of solder balls studied. Main objective of this work is to establish the optimal and necessary concentration of nitrogen for each application.

Anglický abstrakt

This article deals with the influence of different atmosphere (normal, vapor, nitrogen) on some mechanical parameters, as shear strength, for BGA solder balls (Sn63Pb37, SAC305). There are also micro-sections of solder balls studied. Main objective of this work is to establish the optimal and necessary concentration of nitrogen for each application.

BibTex


@article{BUT100913,
  author="Alexandr {Otáhal} and Ivan {Szendiuch}",
  title="Study of Atmosphere Influence on BGA Solder Balls Process",
  annote="This article deals with the influence of different atmosphere (normal, vapor, nitrogen) on some mechanical parameters, as shear strength, for BGA solder balls (Sn63Pb37, SAC305). There are also micro-sections of solder balls studied. Main objective of this work is to establish the optimal and necessary concentration of nitrogen for each application.",
  address="UAB",
  chapter="100913",
  howpublished="electronic, physical medium",
  institution="UAB",
  number="2013",
  volume="36",
  year="2013",
  month="june",
  pages="121--126",
  publisher="UAB",
  type="journal article"
}