Detail publikace
The Increasing Importance of the Thermal Management for Modern Electronic Packages
PSOTA, B. SZENDIUCH, I.
Originální název
The Increasing Importance of the Thermal Management for Modern Electronic Packages
Anglický název
The Increasing Importance of the Thermal Management for Modern Electronic Packages
Jazyk
en
Originální abstrakt
This paper deals with the modification of the thermal management for the modern types of the electronic packages. There is emphasized influence of the package mounting and additional adjustments of the PCB on the final thermal properties of the system. The results are gained through the computer simulation in the ANSYS software.
Anglický abstrakt
This paper deals with the modification of the thermal management for the modern types of the electronic packages. There is emphasized influence of the package mounting and additional adjustments of the PCB on the final thermal properties of the system. The results are gained through the computer simulation in the ANSYS software.
Dokumenty
BibTex
@article{BUT96451,
author="Boleslav {Psota} and Ivan {Szendiuch}",
title="The Increasing Importance of the Thermal Management for Modern Electronic Packages",
annote="This paper deals with the modification of the thermal management for the modern types of the electronic packages. There is emphasized influence of the package mounting and additional adjustments of the PCB on the final thermal properties of the system. The results are gained through the computer simulation in the ANSYS software.",
address="Fakulta Elektrotechnická ZČU v Plzni",
chapter="96451",
institution="Fakulta Elektrotechnická ZČU v Plzni",
number="VI.",
volume="2012",
year="2012",
month="december",
pages="1--5",
publisher="Fakulta Elektrotechnická ZČU v Plzni",
type="journal article - other"
}