Detail publikace

Thick Film 3-D Electrode Configuration for Electrochemical Applications

ADÁMEK, M. ŠTEKOVIČ, M. SZENDIUCH, I.

Originální název

Thick Film 3-D Electrode Configuration for Electrochemical Applications

Anglický název

Thick Film 3-D Electrode Configuration for Electrochemical Applications

Jazyk

en

Originální abstrakt

Miniature electrochemical sensors can be economically produced by thick-film technology. An area of working electrode and an electrode topology design is the important parts of design optimization of electrode system. The design of standard thick-film electrode construction is limited (2-D construction, substrate dimensions, resolution, paste parameters ...). Therefore rules for classical electrode systems cannot be used fully in this case and larger electrode area can be making by 3 D structure only. One of resolutions is unconventional method. The increase of electrode surface by unconventional method – ball and wire bonding is discussed in this paper.

Anglický abstrakt

Miniature electrochemical sensors can be economically produced by thick-film technology. An area of working electrode and an electrode topology design is the important parts of design optimization of electrode system. The design of standard thick-film electrode construction is limited (2-D construction, substrate dimensions, resolution, paste parameters ...). Therefore rules for classical electrode systems cannot be used fully in this case and larger electrode area can be making by 3 D structure only. One of resolutions is unconventional method. The increase of electrode surface by unconventional method – ball and wire bonding is discussed in this paper.

Dokumenty

BibTex 


@inproceedings{BUT95826,
  author="Martin {Adámek} and Michal {Štekovič} and Ivan {Szendiuch}",
  title="Thick Film 3-D Electrode Configuration for Electrochemical Applications",
  annote="Miniature electrochemical sensors can be economically produced by thick-film technology. An area of working electrode and an electrode topology design is the important parts of design optimization of electrode system. The design of standard thick-film electrode construction is limited (2-D construction, substrate dimensions, resolution, paste parameters ...). Therefore rules for classical electrode systems cannot be used fully in this case and larger electrode area can be making by 3 D structure only. One of resolutions is unconventional method. The increase of electrode surface by unconventional method – ball and wire bonding is discussed in this paper.",
  address="Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium",
  booktitle="4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012",
  chapter="95826",
  edition="1",
  howpublished="electronic, physical medium",
  institution="Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium",
  year="2012",
  month="september",
  pages="1--6",
  publisher="Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium",
  type="conference paper"
}