Detail publikace
Thick Film 3-D Electrode Configuration for Electrochemical Applications
ADÁMEK, M. ŠTEKOVIČ, M. SZENDIUCH, I.
Originální název
Thick Film 3-D Electrode Configuration for Electrochemical Applications
Anglický název
Thick Film 3-D Electrode Configuration for Electrochemical Applications
Jazyk
en
Originální abstrakt
Miniature electrochemical sensors can be economically produced by thick-film technology. An area of working electrode and an electrode topology design is the important parts of design optimization of electrode system. The design of standard thick-film electrode construction is limited (2-D construction, substrate dimensions, resolution, paste parameters ...). Therefore rules for classical electrode systems cannot be used fully in this case and larger electrode area can be making by 3 D structure only. One of resolutions is unconventional method. The increase of electrode surface by unconventional method – ball and wire bonding is discussed in this paper.
Anglický abstrakt
Miniature electrochemical sensors can be economically produced by thick-film technology. An area of working electrode and an electrode topology design is the important parts of design optimization of electrode system. The design of standard thick-film electrode construction is limited (2-D construction, substrate dimensions, resolution, paste parameters ...). Therefore rules for classical electrode systems cannot be used fully in this case and larger electrode area can be making by 3 D structure only. One of resolutions is unconventional method. The increase of electrode surface by unconventional method – ball and wire bonding is discussed in this paper.
Dokumenty
BibTex
@inproceedings{BUT95826,
author="Martin {Adámek} and Michal {Štekovič} and Ivan {Szendiuch}",
title="Thick Film 3-D Electrode Configuration for Electrochemical Applications",
annote="Miniature electrochemical sensors can be economically produced by thick-film technology. An area of working electrode and an electrode topology design is the important parts of design optimization of electrode system. The design of standard thick-film electrode construction is limited (2-D construction, substrate dimensions, resolution, paste parameters ...). Therefore rules for classical electrode systems cannot be used fully in this case and larger electrode area can be making by 3 D structure only. One of resolutions is unconventional method. The increase of electrode surface by unconventional method – ball and wire bonding is discussed in this paper.",
address="Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium",
booktitle="4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012",
chapter="95826",
edition="1",
howpublished="electronic, physical medium",
institution="Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium",
year="2012",
month="september",
pages="1--6",
publisher="Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium",
type="conference paper"
}