Detail publikace

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

NICÁK, M. PSOTA, B. KOSINA, P. STARÝ, J. ŠANDERA, J.

Originální název

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper describes design, construction and also some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have an important role, because they not only provide electrical and signal connection, but they also present mechanical attachment between connected substrates. Goal of this work is to develop, simulate and evaluate new structures based on interesting zero shrink Heraeus HL2000 LTCC substrates, where dimples help to reduce thermo-mechanical stress and pads modified with copper to reduce problems with leaching.

Klíčová slova

Packaging, LTCC, ANSYS, Heraues, soldering

Autoři

NICÁK, M.; PSOTA, B.; KOSINA, P.; STARÝ, J.; ŠANDERA, J.

Rok RIV

2012

Vydáno

28. 6. 2012

Nakladatel

Ing. Vladislav Novotný - Litera

Místo

Tabor 43a,612 00 Brno

ISBN

978-80-214-4539-0

Kniha

Electronics Devices and Systems 2012

Edice

1

Číslo edice

1

Strany od

245

Strany do

251

Strany počet

6

BibTex

@inproceedings{BUT95801,
  author="Michal {Nicák} and Boleslav {Psota} and Petr {Kosina} and Jiří {Starý} and Josef {Šandera}",
  title="PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS",
  booktitle="Electronics Devices and Systems 2012",
  year="2012",
  series="1",
  number="1",
  pages="245--251",
  publisher="Ing. Vladislav Novotný - Litera",
  address="Tabor 43a,612 00 Brno",
  isbn="978-80-214-4539-0"
}