Detail publikace

Microstructural stability of ultrafine grained copper at elevated temperature

PANTĚLEJEV, L. MAN, O. KUNZ, L.

Originální název

Microstructural stability of ultrafine grained copper at elevated temperature

Český název

Microstructural stability of ultrafine grained copper at elevated temperature

Typ

článek v časopise - ostatní, Jost

Jazyk

cs

Originální abstrakt

Thermal stability of ultrafine grained (UFG) structure of 99.9 % pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at temperature range from 180 centigrade to 300 centigrade in a tube furnace under argon as a protecting gas. The dwell times were in the range from 10 min to 300 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the changes of UFG structure. More advanced analysis of the EBSD results based on kernel average misorientation (KAM) parameter was performed.

Český abstrakt

Thermal stability of ultrafine grained (UFG) structure of 99.9 % pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at temperature range from 180 centigrade to 300 centigrade in a tube furnace under argon as a protecting gas. The dwell times were in the range from 10 min to 300 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the changes of UFG structure. More advanced analysis of the EBSD results based on kernel average misorientation (KAM) parameter was performed.

Klíčová slova

ultrafine grained microstructure, copper, microstructural stability, electron backscattering diffraction (EBSD)

Rok RIV

2011

Vydáno

13.09.2011

Nakladatel

Technická universita Košice

Místo

Košice

Strany od

158

Strany do

162

Strany počet

5

Dokumenty

BibTex


@article{BUT74820,
  author="Libor {Pantělejev} and Ondřej {Man} and Ludvík {Kunz}",
  title="Microstructural stability of ultrafine grained copper at elevated temperature",
  annote="Thermal stability of ultrafine grained (UFG) structure of 99.9 % pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at temperature range from 180 centigrade to 300 centigrade in a tube furnace under argon as a protecting gas. The dwell times were in the range from 10 min to 300 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the changes of UFG structure. More advanced analysis of the EBSD results based on kernel average misorientation (KAM) parameter was performed.",
  address="Technická universita Košice",
  chapter="74820",
  institution="Technická universita Košice",
  journal="Acta Metallurgica Slovaca",
  number="3",
  volume="17",
  year="2011",
  month="september",
  pages="158--162",
  publisher="Technická universita Košice",
  type="journal article - other"
}