Detail publikace

3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers

NICÁK, M. ŠANDERA, J.

Originální název

3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers

Anglický název

3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers

Jazyk

en

Originální abstrakt

Interconnections have an important role in packaging as they not only provide electrical connection but they also act as mechanical attachment between connected substrates and are supposed to be as reliable as possible. This paper describes design, construction and some recent laboratory tests of 3D stacked structures, where different materials with different coefficient of thermal expansion are combined together in one package. Goal of this work is to develop reliable 3D stacked structure intercronnection method, which will allow connection between LTCC, Al2O3 and also flexible substrates.

Anglický abstrakt

Interconnections have an important role in packaging as they not only provide electrical connection but they also act as mechanical attachment between connected substrates and are supposed to be as reliable as possible. This paper describes design, construction and some recent laboratory tests of 3D stacked structures, where different materials with different coefficient of thermal expansion are combined together in one package. Goal of this work is to develop reliable 3D stacked structure intercronnection method, which will allow connection between LTCC, Al2O3 and also flexible substrates.

Dokumenty

BibTex 


@inproceedings{BUT73400,
  author="Michal {Nicák} and Josef {Šandera}",
  title="3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers",
  annote="Interconnections have an important role in packaging as they not only provide electrical connection but they also act as mechanical attachment between connected substrates and are supposed to be as reliable as possible. This paper describes design, construction and some recent laboratory tests of 3D stacked structures, where different materials with different coefficient of thermal expansion are combined together in one package. Goal of this work is to develop reliable 3D stacked structure intercronnection method, which will allow connection between LTCC, Al2O3 and also flexible substrates.",
  address="IMAPS-Europe",
  booktitle="Proceedings of 18th European microelectronics packaging conference EMPC 2011",
  chapter="73400",
  howpublished="print",
  institution="IMAPS-Europe",
  year="2011",
  month="september",
  pages="358--361",
  publisher="IMAPS-Europe",
  type="conference paper"
}