Detail publikace

MSM realized by Thick Film Technology

SZENDIUCH, I.

Originální název

MSM realized by Thick Film Technology

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Multi Substrate Modules (MSM) are constructed as the stacked packages. One of themost significant advances is high flexibility and possibility to build a cheap electronic system. They give a good ooportunity to construct high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality than can be achieved through multiple package solutions technologies. To describe and discuss some of the possible ways is the aim of this article.

Klíčová slova

Multi Substrate Modules (MSM), Stacking, Ball-termminal, Edge-terminal

Autoři

SZENDIUCH, I.

Rok RIV

2002

Vydáno

1. 1. 2002

Nakladatel

Vysoké učení technické v Brně

Místo

Brno

ISBN

80-214-2180-0

Kniha

ELECTRONIC DEVICES AND SYSTEMS 02 - PROCEEDINGS

Strany od

211

Strany do

215

Strany počet

5

BibTex

@inproceedings{BUT4949,
  author="Ivan {Szendiuch}",
  title="MSM realized by Thick Film Technology",
  booktitle="ELECTRONIC DEVICES AND SYSTEMS 02 - PROCEEDINGS",
  year="2002",
  pages="5",
  publisher="Vysoké učení technické v Brně",
  address="Brno
",
  isbn="80-214-2180-0"
}