Detail publikace

Wafer-level packaging vs. chip-level Packaging

Originální název

Wafer-level packaging vs. chip-level Packaging

Anglický název

Wafer-level packaging vs. chip-level Packaging

Jazyk

en

Originální abstrakt

see paper

Anglický abstrakt

see paper

BibTex


@inproceedings{BUT3727,
  author="Ivan {Szendiuch}",
  title="Wafer-level packaging vs. chip-level Packaging",
  annote="see paper",
  address="Ing. Zdeněk Novotný",
  booktitle="Intensive Training Programme in Electronic System Design, Proceedings",
  chapter="3727",
  institution="Ing. Zdeněk Novotný",
  year="2001",
  month="january",
  pages="54",
  publisher="Ing. Zdeněk Novotný",
  type="conference paper"
}