Detail publikace

Anodic bonding process in MEMS applications

Originální název

Anodic bonding process in MEMS applications

Anglický název

Anodic bonding process in MEMS applications

Jazyk

en

Originální abstrakt

Anodic bonding is a method for joining glass to silicon. It is one of the important steps for packaging MEMS components. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the colour to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.

Anglický abstrakt

Anodic bonding is a method for joining glass to silicon. It is one of the important steps for packaging MEMS components. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the colour to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.

Dokumenty

BibTex


@inproceedings{BUT34624,
  author="Jan {Pekárek} and Radimír {Vrba} and Martin {Magát}",
  title="Anodic bonding process in MEMS applications",
  annote="Anodic bonding is a method for joining glass to silicon. It is one of the important steps for packaging MEMS components. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the colour to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.",
  address="Brno University of Technology, Faculty of Electrical Engineering and Communication",
  booktitle="Proceedings of 8th international conference KRÁLÍKY 2010",
  chapter="34624",
  howpublished="print",
  institution="Brno University of Technology, Faculty of Electrical Engineering and Communication",
  year="2010",
  month="august",
  pages="103--105",
  publisher="Brno University of Technology, Faculty of Electrical Engineering and Communication",
  type="conference paper"
}