Detail publikace

Interconnection of the back side contact solar cell and the ceramic substrate

Jakubka,L., Novotny,M., Szendiuch,I.

Originální název

Interconnection of the back side contact solar cell and the ceramic substrate

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step.

Klíčová slova v angličtině

Interconnection, Back Side Contact Solar Cell, Reliability

Autoři

Jakubka,L., Novotny,M., Szendiuch,I.

Rok RIV

2006

Vydáno

1. 1. 2006

Nakladatel

Darko Belavič

Místo

Ljubljana

ISBN

961-91023-4-7

Kniha

4th European Microelectronics and Packaging Symposium, EMPS 2006 Proceedings

Číslo edice

první

Strany od

387

Strany do

390

Strany počet

4

BibTex

@inproceedings{BUT18877,
  author="Luboš {Jakubka} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Interconnection of the back side contact solar cell and the ceramic substrate",
  booktitle="4th European Microelectronics and Packaging Symposium, EMPS 2006 Proceedings",
  year="2006",
  number="první",
  pages="4",
  publisher="Darko Belavič",
  address="Ljubljana",
  isbn="961-91023-4-7"
}