Detail publikace

Finite Element Modeling of Surface Mount Devices

NOVOTNÝ, M., SZENDIUCH, I., BULVA, J.

Originální název

Finite Element Modeling of Surface Mount Devices

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The aim of this work is to improve reliability of SMD connecting and to increase durability of these structures. Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing. This paper describes recent developments made to the finite element modeling of SMD, extending its capability to handle viscoplastic behaviour. It also presents the validation of this approach and results obtained for an SMD. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented in the ANSYS finite element simulation software tool.

Klíčová slova v angličtině

finite element modeling, SMD, thermomechanical stressing

Autoři

NOVOTNÝ, M., SZENDIUCH, I., BULVA, J.

Rok RIV

2005

Vydáno

1. 1. 2005

Nakladatel

TU Wien

Místo

Wien

ISBN

0-7803-9325-2

Kniha

Proceedings of ISSE 2005

Číslo edice

první

Strany od

97

Strany do

101

Strany počet

5

BibTex

@inproceedings{BUT17411,
  author="Marek {Novotný} and Ivan {Szendiuch} and Jindřich {Bulva}",
  title="Finite Element Modeling of Surface Mount Devices",
  booktitle="Proceedings of ISSE 2005",
  year="2005",
  volume="1",
  number="první",
  pages="5",
  publisher="TU Wien",
  address="Wien",
  isbn="0-7803-9325-2"
}