Detail publikace

Reliability of Solder Joint and SMT Assembly

ŠANDERA, J.

Originální název

Reliability of Solder Joint and SMT Assembly

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The simulation of thermomechanical stress in SMD chip components is presented.Special mechanical system with low temperature capacity for measuring of reliability is designed and presented.

Klíčová slova

thermomechanical stress, SMD components, temperature cycling

Autoři

ŠANDERA, J.

Rok RIV

2005

Vydáno

2. 2. 2005

Místo

Tarragona, Španělsko

ISBN

0-7803-8811-9

Kniha

2005-Spanish Conference on Electron Devices

Strany od

25

Strany do

28

Strany počet

4

BibTex

@inproceedings{BUT16998,
  author="Josef {Šandera}",
  title="Reliability of Solder Joint and SMT Assembly",
  booktitle="2005-Spanish Conference on Electron Devices",
  year="2005",
  pages="4",
  address="Tarragona, Španělsko",
  isbn="0-7803-8811-9"
}