Detail publikace

Study of behaviour of thermal insulation materials under extremely low pressure

ZACH, J. PETERKOVÁ, J. BUBENÍK, J.

Originální název

Study of behaviour of thermal insulation materials under extremely low pressure

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

In most thermal insulation materials, reduced internal pressure improves thermal insulation properties. It reduces heat transport by convection as well as heat conduction in gases in the material´s pore structure. The dependence of thermal conductivity on pressure is individual to every type of insulation with open porosity. In general, a material with fine porosity is not very sensitive to pressure change within the range of very low pressure to vacuum. On the other hand, materials with a larger number of bigger pores are more sensitive to changing pressure. Any pressure change between atmosphere pressure and vacuum causes a change in thermal conductivity. The paper presents the results of an investigation into the behaviour of alternative fibrous insulations usable in the production of vacuum insulation panels at low pressure.

Klíčová slova

Thermal insulation materials; porosity; vacuum; low pressure; thermal conductivity.

Autoři

ZACH, J.; PETERKOVÁ, J.; BUBENÍK, J.

Vydáno

2. 9. 2019

Nakladatel

EDP Sciences

Místo

Francie

ISSN

2261-236X

Periodikum

MATEC Web of Conferences

Ročník

282

Číslo

1

Stát

Francouzská republika

Strany od

1

Strany do

6

Strany počet

6

URL

Plný text v Digitální knihovně

BibTex

@inproceedings{BUT158999,
  author="Jiří {Zach} and Jitka {Peterková} and Jan {Bubeník}",
  title="Study of behaviour of thermal insulation materials under extremely low pressure",
  booktitle="4th Central European Symposium on Building Physics (CESBP 2019)",
  year="2019",
  journal="MATEC Web of Conferences",
  volume="282",
  number="1",
  pages="1--6",
  publisher="EDP Sciences",
  address="Francie",
  doi="10.1051/matecconf/201928202044",
  issn="2261-236X",
  url="https://www.matec-conferences.org/articles/matecconf/pdf/2019/31/matecconf_cesbp2019_02044.pdf"
}