Detail publikace

Processing of Al-Sc aluminum alloy using SLM technology

KOUTNÝ, D. SKULINA, D. PANTĚLEJEV, L. PALOUŠEK, D. LENCZOWSKI, B. PALM, F. NICK, A.

Originální název

Processing of Al-Sc aluminum alloy using SLM technology

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The proposed paper deals with the experimental determination of process parameters reaching densities >99 % for Scandium modified aluminum alloy (Scalmalloy®) processed by SLM 280HL. The alloy achieves significantly higher yield strength and higher elongation than the AlSi10Mg aluminum alloy figcommonly used. Potential of this alloy is for lightweight applications in space, aerospace, and automotive industries, where is a need of the best possible stiffness to weight ratio. Experiments were provided with different values of laser power and laser scanning speed. Layer thickness and other parameters stayed unchanged. The X-ray micro-computed tomography (μCT) scanning of the tensile specimen was used in order to obtain qualitative and quantitative information about the porosity.

Klíčová slova

Selective Laser Melting; SLM; Al-Sc alloy; Scalmalloy®; Microstructure; Mechanical properties

Autoři

KOUTNÝ, D.; SKULINA, D.; PANTĚLEJEV, L.; PALOUŠEK, D.; LENCZOWSKI, B.; PALM, F.; NICK, A.

Vydáno

3. 9. 2018

Nakladatel

Elsevier BV

ISSN

2212-8271

Periodikum

Procedia CIRP

Ročník

74

Číslo

2018

Stát

Nizozemsko

Strany od

44

Strany do

48

Strany počet

5

URL

https://linkinghub.elsevier.com/retrieve/pii/S2212827118308114

BibTex

@inproceedings{BUT150791,
  author="KOUTNÝ, D. and SKULINA, D. and PANTĚLEJEV, L. and PALOUŠEK, D. and LENCZOWSKI, B. and PALM, F. and NICK, A.",
  title="Processing of Al-Sc aluminum alloy using SLM technology",
  booktitle="10TH CIRP CONFERENCE ON PHOTONIC TECHNOLOGIES",
  year="2018",
  journal="Procedia CIRP",
  volume="74",
  number="2018",
  pages="44--48",
  publisher="Elsevier BV",
  doi="10.1016/j.procir.2018.08.027",
  issn="2212-8271",
  url="https://linkinghub.elsevier.com/retrieve/pii/S2212827118308114"
}