Detail publikace

Effect of wood chips properties on mineralogical composition and microstructure of silicate matrix based composites

MELICHAR, T. BYDŽOVSKÝ, J. DUFKA, A.

Originální název

Effect of wood chips properties on mineralogical composition and microstructure of silicate matrix based composites

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The research presented in this article was focused on proving the effect of wood chips parameters on the hardening process of silicate matrix in cement-bonded particleboard. Namely content of humidity in the chips (in range 30 to 90%) was significant. This amount of humidity was chosen with respect to real conditions of cement-bonded particleboards production. Influence of humidity could be reflected in the content of sugar (cellulose etc.) in wooden chips. The sugars affect the hardening of matrix negatively. Thus, phase composition and microstructure of matrix of cement-bonded particle boards were analysed during 2 to 28 days. Investigation of physico-chemical parameters and microstructure was also supplemented by verification of the basic material characteristics of cement-bonded particleboards (strength and modulus of elasticity in bending, transverse tensile strength perpendicular to the plane of the board, etc.).

Klíčová slova

Wood chips; effect; humidity; mineralogical composition; microstructure; silicate matrix; composite.

Autoři

MELICHAR, T.; BYDŽOVSKÝ, J.; DUFKA, A.

Vydáno

16. 7. 2018

Nakladatel

IOP Publishing

Místo

Great Britain

ISSN

1757-8981

Periodikum

IOP Conference Series: Materials Science and Engineering

Ročník

385

Číslo

1

Stát

Spojené království Velké Británie a Severního Irska

Strany od

1

Strany do

6

Strany počet

6

URL

Plný text v Digitální knihovně

BibTex

@inproceedings{BUT149017,
  author="Tomáš {Melichar} and Jiří {Bydžovský} and Amos {Dufka}",
  title="Effect of wood chips properties on mineralogical composition and microstructure of silicate matrix based composites",
  booktitle="Construmat 2018",
  year="2018",
  journal="IOP Conference Series: Materials Science and Engineering",
  volume="385",
  number="1",
  pages="1--6",
  publisher="IOP Publishing",
  address="Great Britain",
  doi="10.1088/1757-899X/385/1/012035",
  issn="1757-8981",
  url="http://iopscience.iop.org/article/10.1088/1757-899X/385/1/012035"
}