Detail publikace

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

BULVA, J., NOVOTNÝ, M., SZENDIUCH, I.

Originální název

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

Klíčová slova v angličtině

ANSYS, modelling, reliability, Lead-free

Autoři

BULVA, J., NOVOTNÝ, M., SZENDIUCH, I.

Rok RIV

2005

Vydáno

1. 1. 2005

Nakladatel

IMAPS BENELUX

Místo

Brugge, Belgium

Strany od

546

Strany do

1095

Strany počet

550

BibTex

@inproceedings{BUT14828,
  author="Jindřich {Bulva} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling",
  booktitle="15th European Microelectronics and Packaging Conference & Exhibition",
  year="2005",
  pages="550",
  publisher="IMAPS BENELUX",
  address="Brugge, Belgium"
}