Detail publikace

Developement of a test environment for the measurement of mechanical stress in packaged integrated circuits

Zdenek Barton, Jiri Horky, Jozef Vanneuville, Dorine Gevaert

Originální název

Developement of a test environment for the measurement of mechanical stress in packaged integrated circuits

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

Due to thermal and mechanical loading during manufacturing of integrated curcuits, stress is produced on the silicon chip. The equipment described allows in depth study of the stress and is used during developementof new methodologies of packaging.

Klíčová slova v angličtině

mechanical stress, reliability, packages, intergated ciruits

Autoři

Zdenek Barton, Jiri Horky, Jozef Vanneuville, Dorine Gevaert

Rok RIV

2004

Vydáno

1. 1. 2003

Místo

Brno

ISBN

80-214-2452-4

Kniha

Proceedings of the 10th Electronic Devices and Systems Conference EDS 2003

Strany od

1

Strany do

5

Strany počet

5

BibTex

@inproceedings{BUT14339,
  author="Zdeněk {Bartoň}",
  title="Developement of a test environment for the measurement of mechanical stress in packaged integrated circuits",
  booktitle="Proceedings of the 10th Electronic Devices and Systems Conference EDS 2003",
  year="2003",
  volume="2003",
  pages="5",
  address="Brno",
  isbn="80-214-2452-4"
}