Detail publikace
Extending the Validity of the Time-Domain Contour Integral Method Using the Admittance-Wall Boundary Condition
ŠTUMPF, M.
Originální název
Extending the Validity of the Time-Domain Contour Integral Method Using the Admittance-Wall Boundary Condition
Anglický název
Extending the Validity of the Time-Domain Contour Integral Method Using the Admittance-Wall Boundary Condition
Jazyk
en
Originální abstrakt
The admittance-wall boundary condition is incorporated in the time-domain contour integral method. It is shown that the inclusion of the radiating wall amounts to adding a single matrix in the resulting marching-on-in-time scheme. An illustrative numerical example demonstrates that even a simple instantaneously-reacting uniform edge admittance may improve the validity of results with respect to the standard formulation based on the (closed) cavity model.
Anglický abstrakt
The admittance-wall boundary condition is incorporated in the time-domain contour integral method. It is shown that the inclusion of the radiating wall amounts to adding a single matrix in the resulting marching-on-in-time scheme. An illustrative numerical example demonstrates that even a simple instantaneously-reacting uniform edge admittance may improve the validity of results with respect to the standard formulation based on the (closed) cavity model.
Dokumenty
BibTex
@inproceedings{BUT138295,
author="Martin {Štumpf}",
title="Extending the Validity of the Time-Domain Contour Integral Method Using the Admittance-Wall Boundary Condition",
annote="The admittance-wall boundary condition is incorporated in the time-domain contour integral method. It is shown
that the inclusion of the radiating wall amounts to adding a single matrix in the resulting marching-on-in-time scheme. An
illustrative numerical example demonstrates that even a simple instantaneously-reacting uniform edge admittance may improve the validity of results with respect to the standard formulation based on the (closed) cavity model.",
address="IEEE EMC Society",
booktitle="Proceedings of The 2017 IEEE International Symposium on Electromagnetic Compatibility",
chapter="138295",
doi="10.1109/ISEMC.2017.8077967",
howpublished="electronic, physical medium",
institution="IEEE EMC Society",
year="2017",
month="august",
pages="751--755",
publisher="IEEE EMC Society",
type="conference paper"
}