Detail publikace

Extending the Validity of the Time-Domain Contour Integral Method Using the Admittance-Wall Boundary Condition

Originální název

Extending the Validity of the Time-Domain Contour Integral Method Using the Admittance-Wall Boundary Condition

Anglický název

Extending the Validity of the Time-Domain Contour Integral Method Using the Admittance-Wall Boundary Condition

Jazyk

en

Originální abstrakt

The admittance-wall boundary condition is incorporated in the time-domain contour integral method. It is shown that the inclusion of the radiating wall amounts to adding a single matrix in the resulting marching-on-in-time scheme. An illustrative numerical example demonstrates that even a simple instantaneously-reacting uniform edge admittance may improve the validity of results with respect to the standard formulation based on the (closed) cavity model.

Anglický abstrakt

The admittance-wall boundary condition is incorporated in the time-domain contour integral method. It is shown that the inclusion of the radiating wall amounts to adding a single matrix in the resulting marching-on-in-time scheme. An illustrative numerical example demonstrates that even a simple instantaneously-reacting uniform edge admittance may improve the validity of results with respect to the standard formulation based on the (closed) cavity model.

Dokumenty

BibTex 


@inproceedings{BUT138295,
  author="Martin {Štumpf}",
  title="Extending the Validity of the Time-Domain Contour Integral Method Using the Admittance-Wall Boundary Condition",
  annote="The admittance-wall boundary condition is incorporated in the time-domain contour integral method. It is shown
that the inclusion of the radiating wall amounts to adding a single matrix in the resulting marching-on-in-time scheme. An
illustrative numerical example demonstrates that even a simple instantaneously-reacting uniform edge admittance may improve the validity of results with respect to the standard formulation based on the (closed) cavity model.",
  address="IEEE EMC Society",
  booktitle="Proceedings of The 2017 IEEE International Symposium on Electromagnetic Compatibility",
  chapter="138295",
  doi="10.1109/ISEMC.2017.8077967",
  howpublished="electronic, physical medium",
  institution="IEEE EMC Society",
  year="2017",
  month="august",
  pages="751--755",
  publisher="IEEE EMC Society",
  type="conference paper"
}