Detail publikace

Influence of residual stresses and particle properties on mechanical response of the material in particulate ceramic composites

ŠTEGNEROVÁ, K. NÁHLÍK, L. HUTAŘ, P. POKORNÝ, P. MAJER, Z.

Originální název

Influence of residual stresses and particle properties on mechanical response of the material in particulate ceramic composites

Typ

článek v časopise ve Scopus, Jsc

Jazyk

angličtina

Originální abstrakt

Contribution deals with the issue of mechanical response of the particulate ceramic composites used in microelectronic. Mechanical properties and behaviour of composites are highly influenced by residual stresses which are developed in material during cooling in manufacturing process due to the different coefficients of thermal expansions of individual constituents. The main aim of this paper is to estimate the elastic constants and strength of the selected particulate ceramic composites with considering the residual stresses. Three dimensional model and finite element method are used for numerical simulations. Results lead to determination and better understanding of mechanical behaviour of the studied particulate composites.

Klíčová slova

Particulate ceramic composite, residual stresses, finite element method, ceramics for microelectronics, mechanical response

Autoři

ŠTEGNEROVÁ, K.; NÁHLÍK, L.; HUTAŘ, P.; POKORNÝ, P.; MAJER, Z.

Vydáno

12. 9. 2016

Nakladatel

Trans Tech Publications Ltd, Switzerland

ISSN

1013-9826

Periodikum

Key Engineering Materials (print)

Ročník

1

Číslo

713

Stát

Švýcarská konfederace

Strany od

212

Strany do

215

Strany počet

4

URL

http://www.scientific.net/KEM.713.212

BibTex

@article{BUT127598,
  author="Kateřina {Štegnerová} and Luboš {Náhlík} and Pavel {Hutař} and Pavel {Pokorný} and Zdeněk {Majer}",
  title="Influence of residual stresses and particle properties on mechanical response of the material in particulate ceramic composites",
  journal="Key Engineering Materials (print)",
  year="2016",
  volume="1",
  number="713",
  pages="212--215",
  doi="10.4028/www.scientific.net/KEM.713.212",
  issn="1013-9826",
  url="http://www.scientific.net/KEM.713.212"
}