Detail publikace
ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS
VALA, R. TOUFAR, M.
Originální název
ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS
Český název
ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
cs
Originální abstrakt
This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.
Český abstrakt
This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.
Klíčová slova
BGA, flux, solder, repair
Vydáno
28.04.2016
Nakladatel
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Místo
Brno
ISBN
978-80-214-5350-0
Kniha
Proceedings of the 22nd Conference Student EEICT 2016
Strany od
203
Strany do
205
Strany počet
777
BibTex
@inproceedings{BUT127136,
author="Radek {Vala} and Michal {Toufar}",
title="ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS",
annote="This paper deals with rework of BGA components. The first part is focused on defects
and errors in a solder joint. The main part chooses two methods for application flux and solders
paste. The final part is focused on dipping and dispensing.",
address="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
booktitle="Proceedings of the 22nd Conference Student EEICT 2016",
chapter="127136",
howpublished="electronic, physical medium",
institution="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
year="2016",
month="april",
pages="203--205",
publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
type="conference paper"
}