Detail publikace

Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications

Originální název

Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications

Anglický název

Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications

Jazyk

en

Originální abstrakt

The article deals with creating solid joints of Low Temperature Co-fired Ceramic with Al2O3 (Alumina) or SiC chips. The aim of this study is to find material of standard thick film layer (TFL) process, which would be useful for electronic chip packages designed for higher operating temperatures (from 150 up to 800 °C).

Anglický abstrakt

The article deals with creating solid joints of Low Temperature Co-fired Ceramic with Al2O3 (Alumina) or SiC chips. The aim of this study is to find material of standard thick film layer (TFL) process, which would be useful for electronic chip packages designed for higher operating temperatures (from 150 up to 800 °C).

BibTex


@inproceedings{BUT126860,
  author="Jakub {Somer} and Martin {Klíma} and Petr {Macháč} and Ivan {Szendiuch}",
  title="Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications",
  annote="The article deals with creating solid joints of Low Temperature Co-fired Ceramic with Al2O3 (Alumina) or SiC chips. The aim of this study is to find material of standard thick film layer (TFL) process, which would be useful for electronic chip packages designed for higher operating temperatures (from 150 up to 800 °C).",
  booktitle="Materials Structure & Micromechanics of Fracture (MSMF8)",
  chapter="126860",
  doi="10.4028/www.scientific.net/SSP.258",
  howpublished="online",
  number="258",
  year="2016",
  month="december",
  pages="631--634",
  type="conference paper"
}