Detail publikace

The Mechanical Strength of Solder Joints on PCB with OSP surface protection

Originální název

The Mechanical Strength of Solder Joints on PCB with OSP surface protection

Anglický název

The Mechanical Strength of Solder Joints on PCB with OSP surface protection

Jazyk

en

Originální abstrakt

This paper describes some results obtained by the study of influences of different factors which define reliability of solder joints. Generally, these factors include substrate, type of solder paste, soldered components, surface protection of soldering areas and methods of reflowing. In our case, these influences are evaluated with focus on PCB with OSP surface protection under condition of thermal cycling and shear testing. The results from experimental measuring are complemented with computer analysis of models of solder joints and components in ANSYS. Finally, there is evaluation of practical results in conjunction with simulations.

Anglický abstrakt

This paper describes some results obtained by the study of influences of different factors which define reliability of solder joints. Generally, these factors include substrate, type of solder paste, soldered components, surface protection of soldering areas and methods of reflowing. In our case, these influences are evaluated with focus on PCB with OSP surface protection under condition of thermal cycling and shear testing. The results from experimental measuring are complemented with computer analysis of models of solder joints and components in ANSYS. Finally, there is evaluation of practical results in conjunction with simulations.

BibTex


@inproceedings{BUT125190,
  author="Václav {Novotný} and Martin {Adámek} and Josef {Skácel} and Josef {Šandera} and Radek {Vala}",
  title="The Mechanical Strength of Solder Joints on PCB with OSP surface protection",
  annote="This paper describes some results obtained by the study of influences of different factors which define reliability of solder joints. Generally, these factors include substrate, type of solder paste, soldered components, surface protection of soldering areas and methods of reflowing. In our case, these influences are evaluated with focus on PCB with OSP surface protection under condition of thermal cycling and shear testing. The results from experimental measuring are complemented with computer analysis of models of solder joints and components in ANSYS. Finally, there is evaluation of practical results in conjunction with simulations.",
  address="IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA",
  booktitle="Proceedings of the International Spring Seminar on Electronics Technology, 39th International Spring Seminar on Electronics Technology, ISSE 2016",
  chapter="125190",
  doi="10.1109/ISSE.2016.7563199",
  edition="Volume 2016-September",
  howpublished="electronic, physical medium",
  institution="IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA",
  number="1",
  year="2016",
  month="may",
  pages="249--253",
  publisher="IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA",
  type="conference paper"
}