Detail publikace

Impact of the SiNX Thickness on Passivation Quality and Contact Resistivity of Silicon Solar Cell

MOJROVÁ, B. MIHAILETCHI, V.

Originální název

Impact of the SiNX Thickness on Passivation Quality and Contact Resistivity of Silicon Solar Cell

Anglický název

Impact of the SiNX Thickness on Passivation Quality and Contact Resistivity of Silicon Solar Cell

Jazyk

en

Originální abstrakt

In this work the influence of thickness of Silicon Nitride (SiNX) layer deposited by Plasma Enhanced Chemical Vapour Deposition (PECVD) on passivation quality and contact resis-tivity (ρC) of n-type Passivated Emitter Rear Totally-diffused (n-PERT) cell was investigated. The solar cell structure comprises front boron emitter and a phosphorous back surface field (BSF) with SiNX layers on both sides for surface passivation. Contacts are made by screen printed and fired through metallization using commercial silver (Ag) paste.

Anglický abstrakt

In this work the influence of thickness of Silicon Nitride (SiNX) layer deposited by Plasma Enhanced Chemical Vapour Deposition (PECVD) on passivation quality and contact resis-tivity (ρC) of n-type Passivated Emitter Rear Totally-diffused (n-PERT) cell was investigated. The solar cell structure comprises front boron emitter and a phosphorous back surface field (BSF) with SiNX layers on both sides for surface passivation. Contacts are made by screen printed and fired through metallization using commercial silver (Ag) paste.

Dokumenty

BibTex


@inproceedings{BUT124312,
  author="Barbora {Mojrová} and Valentin {Mihailetchi}",
  title="Impact of the SiNX Thickness on Passivation Quality and Contact Resistivity of Silicon Solar Cell",
  annote="In this work the influence of thickness of Silicon Nitride (SiNX) layer deposited by Plasma Enhanced Chemical Vapour Deposition (PECVD) on passivation quality and contact resis-tivity (ρC) of n-type Passivated Emitter Rear Totally-diffused (n-PERT) cell was investigated. The solar cell structure comprises front boron emitter and a phosphorous back surface field (BSF) with SiNX layers on both sides for surface passivation. Contacts are made by screen printed and fired through metallization using commercial silver (Ag) paste.",
  address="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
  chapter="124312",
  howpublished="electronic, physical medium",
  institution="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  year="2016",
  month="april",
  pages="690--695",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  type="conference paper"
}