Detail publikace

COMPARISON OF QFN AND BGA CHARACTERISTICS

Originální název

COMPARISON OF QFN AND BGA CHARACTERISTICS

Anglický název

COMPARISON OF QFN AND BGA CHARACTERISTICS

Jazyk

en

Originální abstrakt

This paper deals with the issue of packaging and heat transfer in modern microelectronics. Research is focused on the QFN and BGA packages, the most sophisticated conventional solution nowadays. Thermal characteristics are examined through the computer simulations in the program ANSYS Workbench as well as through the experimental measuring. Real measurement is necessary for the verification of the calculated results; afterwards we are able to modify the model to observe the influence of the changes to the package characteristics. Last part is focused on the problem of voids after soldering process in QFN package and comparison of soldering in air and in the desiccator with nitrogen atmosphere with 200ppm residual oxygen. The results are presented through the X-ray inspection of thermal pad.

Anglický abstrakt

This paper deals with the issue of packaging and heat transfer in modern microelectronics. Research is focused on the QFN and BGA packages, the most sophisticated conventional solution nowadays. Thermal characteristics are examined through the computer simulations in the program ANSYS Workbench as well as through the experimental measuring. Real measurement is necessary for the verification of the calculated results; afterwards we are able to modify the model to observe the influence of the changes to the package characteristics. Last part is focused on the problem of voids after soldering process in QFN package and comparison of soldering in air and in the desiccator with nitrogen atmosphere with 200ppm residual oxygen. The results are presented through the X-ray inspection of thermal pad.

BibTex


@inproceedings{BUT120068,
  author="Josef {Skácel} and Boleslav {Psota} and Ivan {Szendiuch}",
  title="COMPARISON OF QFN AND BGA CHARACTERISTICS",
  annote="This paper deals with the issue of packaging and heat transfer in modern microelectronics. Research is focused on the QFN and BGA packages, the most sophisticated conventional solution nowadays. Thermal characteristics are examined through the computer simulations in the program ANSYS Workbench as well as through the experimental measuring. Real measurement is necessary for the verification of the calculated results; afterwards we are able to modify the model to observe the influence of the changes to the package characteristics. Last part is focused on the problem of voids after soldering process in QFN package and comparison of soldering in air and in the desiccator with nitrogen atmosphere with 200ppm residual oxygen. The results are presented through the X-ray inspection of thermal pad.",
  address="Vysoké účení technické v Brně",
  booktitle="IMAPS FLASH CONFERENCE 2015",
  chapter="120068",
  edition="1",
  howpublished="print",
  institution="Vysoké účení technické v Brně",
  year="2015",
  month="october",
  pages="25--26",
  publisher="Vysoké účení technické v Brně",
  type="conference paper"
}