Detail publikace

COMPARISON OF QFN AND BGA CHARACTERISTICS

SKÁCEL, J. PSOTA, B. SZENDIUCH, I.

Originální název

COMPARISON OF QFN AND BGA CHARACTERISTICS

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper deals with the issue of packaging and heat transfer in modern microelectronics. Research is focused on the QFN and BGA packages, the most sophisticated conventional solution nowadays. Thermal characteristics are examined through the computer simulations in the program ANSYS Workbench as well as through the experimental measuring. Real measurement is necessary for the verification of the calculated results; afterwards we are able to modify the model to observe the influence of the changes to the package characteristics. Last part is focused on the problem of voids after soldering process in QFN package and comparison of soldering in air and in the desiccator with nitrogen atmosphere with 200ppm residual oxygen. The results are presented through the X-ray inspection of thermal pad.

Klíčová slova

QFN, BGA, ANSYS, thermo-mechanical behavior

Autoři

SKÁCEL, J.; PSOTA, B.; SZENDIUCH, I.

Rok RIV

2015

Vydáno

15. 10. 2015

Nakladatel

Vysoké účení technické v Brně

Místo

BRNO

ISBN

978-80-214-5270-1

Kniha

IMAPS FLASH CONFERENCE 2015

Edice

1

Číslo edice

1

Strany od

25

Strany do

26

Strany počet

65

BibTex

@inproceedings{BUT120068,
  author="Josef {Skácel} and Boleslav {Psota} and Ivan {Szendiuch}",
  title="COMPARISON OF QFN AND BGA CHARACTERISTICS",
  booktitle="IMAPS FLASH CONFERENCE 2015",
  year="2015",
  series="1",
  number="1",
  pages="25--26",
  publisher="Vysoké účení technické v Brně",
  address="BRNO",
  isbn="978-80-214-5270-1"
}