Detail publikace

Influence of Flux throughout Reflow Process on FBGA Solder Balls

VALA, R. ŘIHÁK, P. SZENDIUCH, I.

Originální název

Influence of Flux throughout Reflow Process on FBGA Solder Balls

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

The paper is focused on influence of flux during reflow process. Smaller and lighter FBGA packages caused formation of defects. Analysis of proper soldering process of FBGA components is crucial for correct function of a device. Detection of defects after reflow process is an important part of solder joints reliability. This paper deals with particular parameters which affected yield of FBGA rework process.

Klíčová slova

FBGA, solder alloy, flux, X-Ray.

Autoři

VALA, R.; ŘIHÁK, P.; SZENDIUCH, I.

Rok RIV

2015

Vydáno

6. 5. 2015

Nakladatel

Budapest University of Technology and Economics

Místo

Hungary

ISBN

978-963-313-177-0

Kniha

Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology

Strany od

250

Strany do

254

Strany počet

5

URL

https://ieeexplore.ieee.org/document/7248000

BibTex

@inproceedings{BUT117451,
  author="Radek {Vala} and Pavel {Řihák} and Ivan {Szendiuch}",
  title="Influence of Flux throughout Reflow Process on FBGA Solder Balls",
  booktitle="Novel Trends in Electronic Manufacturing  - Book of Abstracts 38th International Spring Seminar on Electronics Technology",
  year="2015",
  pages="250--254",
  publisher="Budapest University of Technology and Economics",
  address="Hungary",
  doi="10.1109/ISSE.2015.7248000",
  isbn="978-963-313-177-0",
  url="https://ieeexplore.ieee.org/document/7248000"
}