Detail publikace

Influence of Flux throughout Reflow Process on FBGA Solder Balls

Originální název

Influence of Flux throughout Reflow Process on FBGA Solder Balls

Anglický název

Influence of Flux throughout Reflow Process on FBGA Solder Balls

Jazyk

en

Originální abstrakt

The paper is focused on influence of flux during reflow process. Smaller and lighter FBGA packages caused formation of defects. Analysis of proper soldering process of FBGA components is crucial for correct function of a device. Detection of defects after reflow process is an important part of solder joints reliability. This paper deals with particular parameters which affected yield of FBGA rework process.

Anglický abstrakt

The paper is focused on influence of flux during reflow process. Smaller and lighter FBGA packages caused formation of defects. Analysis of proper soldering process of FBGA components is crucial for correct function of a device. Detection of defects after reflow process is an important part of solder joints reliability. This paper deals with particular parameters which affected yield of FBGA rework process.

BibTex


@inproceedings{BUT117451,
  author="Radek {Vala} and Pavel {Řihák} and Ivan {Szendiuch}",
  title="Influence of Flux throughout Reflow Process on FBGA Solder Balls",
  annote="The paper is focused on influence of flux during reflow process. Smaller and lighter FBGA packages caused formation of defects. Analysis of proper soldering process of FBGA components is crucial for correct function of a device. Detection of defects after reflow process is an important part of solder joints reliability. This paper deals with particular parameters which affected yield of FBGA rework process.",
  address="Budapest University of Technology and Economics",
  booktitle="Novel Trends in Electronic Manufacturing  - Book of Abstracts 38th International Spring Seminar on Electronics Technology",
  chapter="117451",
  howpublished="print",
  institution="Budapest University of Technology and Economics",
  year="2015",
  month="may",
  pages="216--217",
  publisher="Budapest University of Technology and Economics",
  type="conference paper"
}