Detail publikace

Detection of Defects on BGA Solder Balls Using 2D and 3D Methods

Originální název

Detection of Defects on BGA Solder Balls Using 2D and 3D Methods

Anglický název

Detection of Defects on BGA Solder Balls Using 2D and 3D Methods

Jazyk

en

Originální abstrakt

The paper is focused on non-destructive X-Ray method used for detection of defects on BGA solder balls. It is possible to use 2D or 3D methods with imaging of individual layers. 2D method is faster and it is used in daily basis. 3D method is less common and it is used for unique defects for further examination. This paper deals with using these methods especially throughout rework process.

Anglický abstrakt

The paper is focused on non-destructive X-Ray method used for detection of defects on BGA solder balls. It is possible to use 2D or 3D methods with imaging of individual layers. 2D method is faster and it is used in daily basis. 3D method is less common and it is used for unique defects for further examination. This paper deals with using these methods especially throughout rework process.

BibTex


@inproceedings{BUT117450,
  author="Pavel {Řihák} and Radek {Vala} and Ivan {Szendiuch}",
  title="Detection of Defects on BGA Solder Balls Using 2D and 3D Methods",
  annote="The paper is focused on non-destructive X-Ray method used for detection of
defects on BGA solder balls. It is possible to use 2D or 3D methods with imaging of individual
layers. 2D method is faster and it is used in daily basis. 3D method is less common and it is used
for unique defects for further examination. This paper deals with using these methods especially
throughout rework process.",
  address="Budapest University of Technology and Economics",
  booktitle="Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology",
  chapter="117450",
  howpublished="print",
  institution="Budapest University of Technology and Economics",
  year="2015",
  month="may",
  pages="124--125",
  publisher="Budapest University of Technology and Economics",
  type="conference paper"
}