Detail publikace

ANALYSIS AND PREDICTION OF RELIABILITY OF SOLDER JOINTS

NOVOTNÝ, V. ŠANDERA, J.

Originální název

ANALYSIS AND PREDICTION OF RELIABILITY OF SOLDER JOINTS

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This arcticle deals with the sphere of solder joints reliability and narrower focus is using simulation software ANSYS and fatigue models for estimate reliability of solder joints. The text describes the introduction to the issue of the reliability of soldered connections and important factors with their influences. Then are described some options for prediction of reliability. This includes the issue of fatigue models and design of simulation in simulating software ANSYS. In conclusion, there are described outputs of simulations and options for calculation by fatigue models.

Klíčová slova

EEICT, ANSYS, reliability, simulation, solder joints, fatigue models

Autoři

NOVOTNÝ, V.; ŠANDERA, J.

Rok RIV

2015

Vydáno

23. 4. 2015

Nakladatel

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

Místo

Brno

ISBN

978-80-214-5148-3

Kniha

Proceedings of the 21st Conference STUDENT EEICT 2015

Edice

1

Číslo edice

1

ISSN

NEUVEDENO

Strany od

381

Strany do

385

Strany počet

5

BibTex

@inproceedings{BUT115512,
  author="Václav {Novotný} and Josef {Šandera}",
  title="ANALYSIS AND PREDICTION OF RELIABILITY OF SOLDER JOINTS",
  booktitle="Proceedings of the 21st Conference STUDENT EEICT 2015",
  year="2015",
  series="1",
  number="1",
  pages="381--385",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  address="Brno",
  isbn="978-80-214-5148-3"
}