Detail publikace

Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education

Originální název

Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education

Anglický název

Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education

Jazyk

en

Originální abstrakt

This paper deals with innovative education programme in the microelectronics technology area, containing modern technologies of electronic packaging and interconnection. It is applied at Faculty of Electrical Engineering and Communication in Brno University of Technology.

Anglický abstrakt

This paper deals with innovative education programme in the microelectronics technology area, containing modern technologies of electronic packaging and interconnection. It is applied at Faculty of Electrical Engineering and Communication in Brno University of Technology.

BibTex


@proceedings{BUT115458,
  author="Ivan {Szendiuch} and Edita {Hejátková}",
  title="Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education",
  annote="This paper deals with innovative education programme in the microelectronics technology area, containing modern technologies of
electronic packaging and interconnection. It is applied at Faculty of Electrical Engineering and Communication in Brno University
of Technology.",
  address="MATE Ltd., Zagreb",
  booktitle="International Conference on Engineering Education - New Technologies and Innovation for Global Business",
  chapter="115458",
  edition="1",
  howpublished="electronic, physical medium",
  institution="MATE Ltd., Zagreb",
  year="2015",
  month="july",
  pages="451--457",
  publisher="MATE Ltd., Zagreb",
  type="conference proceedings"
}